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A Preview of ABA TECHSHOW 2019

ABA TECHSHOW is right around the corner! In this episode of The Digital Edge, hosts Sharon Nelson and Jim Calloway give a preview of ABA TECHSHOW 2019 with guests Lincoln Mead and John Simek, co-chairs of the conference board. They share how the conference stays current on tech for lawyers and give tips on how to best prepare for attending the show. There will be some new elements for attendees this year, including a new app for the conference, greater cooperation with educators for the academic track, and more focus on involving young lawyers and law students.

Lincoln Mead is the project manager for Canon Discovery Services and co-chair of the 2019 ABA TECHSHOW board.

John Simek is the Vice President of Sensei Enterprises and co-chair of the 2019 ABA TECHSHOW board.

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